Thermal stability and operating reliability of nanosized metal films on insulators and semi-conductors

A comprehensive scientific approach to account for the "cross-effects" influence of physical and thermal deposition process parameters on structure and properties of nanoscale metal films Cu-Sn, Cu-Au, Cu-Mn, Cu-Sn-Mn, Al-Mn-Cr, Ni- Al, Ni-Au, Ti-Ag, Fe-Pt, and etc has been developed. The general regularities of diffusion processes due to subsequent thermal annealing in ultra-high vacuum, oxygen- and hydrogen containing atmosphere, ion-plasma and laser treatment have been discovered.