Kravetz V.Yu.

Heat transfer and fluid dynamics in miniature two-phase heat transfer systems

For the first time a comprehensive study of the processes of heat transfer and hydrodynamics during evaporation and condensation in closed miniature two-phase systems was carried out. The regularities of the influence of geometric and regime factors on the thermal resistance and maximum heat fluxes of miniature heat pipes, thermosyphons and pulsating capillary heat pipes are revealed. The physical model of heat exchange processes in the conditions of limited space at application as heat carriers of ordinary liquids and nanofluids is developed and presented.

The processes of vapor generating in closed miniature evaporation-condensation systems with new coolants for space purposes

A complex study of heat transfer processes in constrained conditions in evaporative-condensation systems was carried out for the first time. A physical model of the boiling process on porous surfaces in conditions of limited space was developed and presented. Dependencies for calculating the heat transfer intensity under such conditions have been obtained. Such dependencies are necessary to create miniature cooling systems for microchips and powerful processors of electronic equipment.

Heat transfer physical process at miniaturization an evaporation-condensing thermal stabilization systems

New complex mathematical model of heat transfer processes in conditions of evaporation-condensation systems (miniature heat pipes, thermosyphons and pulsating heat pipes) inner space decreasing was developed. Criterial relation for evaluation of miniature heat pipes heat transfer ability was obtained as a result of differential equations system and conditions of uniqueness analysis.

Development and investigation of perspective miniature energy saving devices on based of evaporating - condensation cycle.

Analysis of literature sources had shown that up-to-date state of miniaturization of electronic devices needs the development of new small-size cooling systems, which are capable to reject great heat fluxes. Within the bounds of this problem theoretical ground of advisability of using miniature heat pipes, thermosyphones and oscillating heat pipes in cooling systems for a wide range of powerful elements of microelectronic technics was found.